logo
Giá tốt  trực tuyến

Chi tiết sản phẩm

Created with Pixso. Trang chủ Created with Pixso. các sản phẩm Created with Pixso.
Chất nền Sapphire
Created with Pixso.

Sapphire Wafer 6inch C Axis to M Axis 350um Thickness DSP

Sapphire Wafer 6inch C Axis to M Axis 350um Thickness DSP

Tên thương hiệu: ZMSH
Số mẫu: 6 inch
MOQ: 10gieces
Chi tiết bao bì: Gói chân không
Điều khoản thanh toán: T/t
Thông tin chi tiết
Nguồn gốc:
Trung Quốc
Chứng nhận:
RoHS
Đường kính:
6 inch
Độ dày:
350 ± 15um
Độ thô:
Ra ≤ 0,2nm
Biến dạng:
15um
TTV:
10um
Hình dạng:
Tròn, phẳng, notch
Cào/Đào.:
20/10
đánh bóng:
dsp hoặc ssp
Làm nổi bật:

6 inch sapphire wafer DSP

,

trục C đến trục M nền sapphire

,

Phiên màu saphir dày 350um

Mô tả sản phẩm

Sapphire Wafer 6inch C Axis to M Axis 350um Thickness DSP

 

 

 

Production Description:

Sapphire wafers are single‑crystal substrates grown from high‑purity aluminum oxide (Al₂O₃) via processes such as the Kyropoulos (KY) and Heat Exchanger Method (HEM). Their molecular structure consists of three oxygen atoms and two aluminum atoms covalently bonded in a hexagonal lattice. This structure endows sapphire wafers with a range of superior properties, making them a key material across multiple high‑precision and cutting‑edge fields.

 

 

Product Parameters:

Diameter: 6inch or 150±0.1mm
Thickness: 350±15um; 500 ± 15 um; 1000±15um
Roughness: Ra ≤ 0.2 nm
Warp: ≤ 15um
TTV: ≤ 10um
Polish: DSP (Double Side Polished); SSP(Single Side Polished)
Shape: Round, Flat, Notch
Wafer Orientation: C Axis to M Axis
Edge Form: 45°, C shape
Material: Sapphire
Remarks:

All specifications above can be customized upon your request.

 

Product Pictures:

Sapphire Wafer 6inch C Axis to M Axis 350um Thickness DSP 0

 

 

Product Highlights:

 

* Sapphire wafers are with common crystallographic orientations include C‑plane (0001), A‑plane (11‑20), and R‑plane (1‑102); the choice of orientation tailors optical, mechanical, and epitaxial behavior for specific devices.

 

* Typical optical transmission spans the near‑UV to mid‑infrared (approximately 0.19–5.5 μm), with high transparency in the 0.3–5 μm range, supporting applications in optics and optoelectronics.

 

* Mechanical and thermal properties of sapphire wafers include a Mohs hardness of 9, high strength and wear resistance, and a melting point ~2050°C, enabling performance under extreme environments.

 

* Chemical stability of sapphire wafers is excellent—resistant to most acids and alkalis—with notable attack only by HF, phosphoric acid, and molten KOH at elevated temperatures.

 

* Representative applications of sapphire wafers: LED substrates (GaN on sapphire), infrared and laser windows, optical components, and wear‑resistant covers in consumer electronics.

 

 

Related Product Recommendation:

 

2inch Spphire Wafer  C Axis DSP:

Sapphire Wafer 6inch C Axis to M Axis 350um Thickness DSP 1

 

Q&A:

 

Q: What is a sapphire wafer?

 

A: A sapphire wafer is a circular thin slice made of sapphire material, which is widely used in the manufacturing of semiconductors and optical devices.

 

Q: What size are sapphire wafers?

 

A: 2inch, 3inch, 4inch, 6inch, 8inch, 12inch.

 

Q: How to cut a sapphire wafer?

 

A: Cutting a sapphire wafer requires specialized methods due to its extreme hardness (9 on the Mohs scale, second only to diamond) and brittleness. The core approach relies on abrasive-based or laser-based techniques to achieve precise, low-damage cuts.