|
|
| Tên thương hiệu: | ZMSH |
| MOQ: | 1 |
| giá bán: | by case |
| Chi tiết bao bì: | thùng tùy chỉnh |
| Điều khoản thanh toán: | T/t |
The Diamond Wire Single-Line Cutting Machine is an advanced solution engineered for slicing and shaping ultra-hard and brittle materials. By employing a diamond-coated wire as the cutting medium, the system delivers high-speed, low-damage, and cost-efficient processing. The equipment is particularly well-suited for applications involving sapphire wafers, SiC ingots, quartz plates, ceramics, optical glass, silicon rods, and jade.
Unlike traditional sawing or abrasive wire systems, this technology provides finer accuracy, reduced kerf loss, and improved surface smoothness, making it an indispensable tool across industries such as semiconductors, photovoltaics, LEDs, optics, and gemstone finishing. It excels not only in straight cuts and truncation but also in specialty slicing for oversized or irregular geometries.
The machine operates by driving the diamond wire at ultra-high speeds (up to 1500 m/min), where the abrasive diamond particles grind through material surfaces. Several supporting systems ensure cutting precision and reliability:
Precision Feed Control – Servo-driven feeding system with linear guide rails ensures stable positioning and micron-level accuracy.
Coolant and Cleaning System – Continuous water-based flushing reduces thermal effects, avoids cracks, and removes debris efficiently.
Wire Tension & Bow Management – Automatic tension adjustment minimizes deviation, maintaining consistent cut thickness.
Optional Extensions – Rotary worktables for multi-angle cutting, high-tension modules for extreme hardness, and visual alignment aids for complex structures.
| Item | Parameter | Item | Parameter |
|---|---|---|---|
| Max Work Size | 600×500 mm | Running Speed | 1500 m/min |
| Swing Angle | 0~±12.5° | Acceleration | 5 m/s² |
| Swing Frequency | 6~30 | Cutting Speed | <3 hrs (6-inch SiC) |
| Lift Stroke | 650 mm | Accuracy | <3 μm (6-inch SiC) |
| Sliding Stroke | ≤500 mm | Wire Diameter | φ0.12~φ0.45 mm |
| Lift Speed | 0~9.99 mm/min | Power Consumption | 44.4 kW |
| Rapid Travel Speed | 200 mm/min | Machine Size | 2680×1500×2150 mm |
| Constant Tension | 15.0N~130.0N | Weight | 3600 kg |
| Tension Accuracy | ±0.5 N | Noise | ≤75 dB(A) |
| Center Distance of Guide Wheels | 680~825 mm | Gas Supply | >0.5 MPa |
| Coolant Tank | 30 L | Power Line | 4×16+1×10 mm² |
| Mortar Motor | 0.2 kW | — | — |
High Productivity & Reduced Loss
Wire speed up to 1500 m/min, improving throughput compared with abrasive wire or laser cutting.
Thin kerf width reduces material consumption by up to 30%, optimizing overall yield.
Versatile and User-Friendly
Touchscreen interface with smart parameter storage ensures easy operation.
Supports straight, curved, and multi-slice synchronous cutting for varied production needs.
Expandable Functions
Rotary stage for circular or angled slicing of cylindrical workpieces.
High-tension module (20–60 N range) for SiC, sapphire, and ceramic cutting stability.
Automated tool alignment and optical positioning enhance accuracy for irregular shapes.
Durable Mechanical Design
Heavy-duty casting ensures vibration resistance and long-term accuracy.
Critical wear parts adopt ceramic or tungsten carbide coatings, offering service life beyond 5000 hours.
Semiconductor Manufacturing: Efficient slicing of SiC ingots into substrates with kerf loss <100 μm.
LED & Photonics: Precision sapphire wafer cutting for optical and electronic applications.
Solar Industry: Silicon rod cropping and wafer slicing for photovoltaic cells.
Optical & Jewelry Processing: High-quality quartz and jade slicing with Ra <0.5 μm surface roughness.
Aerospace & Advanced Ceramics: Cutting of AlN, zirconia, and specialty ceramics for high-temperature components.
Q1: What materials can this cutting machine process?
A1: It is optimized for SiC, sapphire, quartz, silicon, ceramics, glass, and gemstones.
Q2: How accurate is the cutting process?
A2: For a 6-inch SiC wafer, cutting accuracy can reach <3 μm, ensuring excellent flatness and surface quality.
Q3: What makes diamond wire cutting better than traditional methods?
A3: Compared to abrasive wire or laser cutting, it offers higher speed, reduced kerf loss, lower thermal stress, and superior edge quality.
Q4: Can the machine handle irregular or cylindrical materials?
A4: Yes. With an optional rotary worktable, the system can perform circular, bevel, or angled cuts on rods and special shapes.
Q5: How is wire tension controlled?
A5: The system includes automatic tension adjustment with precision ±0.5 N, preventing wire breakage and maintaining stable cuts.
Q6: What industries benefit most from this technology?
A6: It is widely used in semiconductors, solar energy, precision optics, jewelry cutting, and aerospace ceramics.
video
